SiC Processing

Address
Dienhof 26
92242 Hirschau
Germany
Phone: 49 9622 70 39 0
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The SiC Group is one of world's leading service providers in the field of mechanical wet-cutting technologies for the wafer industry, including corresponding logistic solutions. It specializes in preparing cutting fluids that are used to produce wafers for the photovoltaic and semiconductor industries. Cutting fluids are a viscous slurry consisting of solid silicon carbide and fluid glycol.