This research focuses on innovative, three-dimensional surface structures suitable for silicon solar cells having either multicrystalline or crystalline substrates. Their thickness is more than 25 µm and efficiency is increased by about 30%. The technology may be suited to different methods of substrate manufacture. The technique is based on standard silicon solar cell manufacturing technology. The theory is based on basic principles of semiconductor devices anticipated to yield desired results. The research is relevant to solar cells, cleantech, devices and applied physics. The technology has patent applications pending in the US, Europe, China, Japan, Korea and Israel.
According to the research findings, innovative three-dimensional geometries on the silicon surface integrated with optimized doping profile and contact electrodes produce a 30 % increase in efficiency with the use of standard microelectronic manufacturing technology.
The key features of this research include the following:
- It is based on standard manufacturing technology.
- There is an increase in efficiency with minimal increase in cost.
- It offers a solution for weakly absorbed red and IR light ensuring higher collection efficiency.
- Is suitable for both crystalline and multi crystalline silicon.
- Series resistance and metal shading losses are significantly reduced.
Silicon wafer-based solar cells presently account for more than 86 % of the commercial solar cell market.
Initial samples are being anticipated from the foundry.
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