FlipChip International, LLC
FlipChip International is the leading provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap™), Redistributed SFC, Wafer UltraCSP™, Spheron™ (High Frequency RF Packaging), EliteCSP™ (a low cost E-less Nickel bumping WLCSP), and Polymer Collar™. FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing.
FlipChip International, Die Sales Division provides semiconductor wafer back-end services including: Dicing, Optical Inspection, Pick-and-Place, Waffle-Pak, and Tape & Reel. DSD specializes in Known Good Die (KGD), Zero Defects (ZD), Automatic Optical Inspection (AOI), Wafer Sawing, Wafer Probe, Wafer Sort, Test, Die Trays, Quick Turns, and Ship Direct of finished die.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.