FlipChip International is the leading provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap™), Redistributed SFC, Wafer UltraCSP™, Spheron™ (High Frequency RF Packaging), EliteCSP™ (a low cost E-less Nickel bumping WLCSP), and Polymer Collar™. FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing.
FlipChip International, Die Sales Division provides semiconductor wafer back-end services including: Dicing, Optical Inspection, Pick-and-Place, Waffle-Pak, and Tape & Reel. DSD specializes in Known Good Die (KGD), Zero Defects (ZD), Automatic Optical Inspection (AOI), Wafer Sawing, Wafer Probe, Wafer Sort, Test, Die Trays, Quick Turns, and Ship Direct of finished die.
The Sensi+™ is a laser-based analyzer used for monitoring natural gas quality.
The LAS MkII Scintillometer by Kipp & Zonen can detect sensible heat fluxes over long distances, up to 4.5km.
The Vocus CI-TOF from TOFWERK provides real-time chemical ionization measurements.
Following on from the Greener Manufacturing Show, AZoCleantech speaks with Christophe Williams, CEO and co-founder of Naked Energy, about the company and its mission to change energy for good by accelerating the transition to net zero carbon.
Ahead of The Greener Manufacturing Show in Cologne on the 9th and 10th of November 2022, AZoCleanTech spoke with Peter Sarno, event director of the show, about the push for sustainable industrial solutions.
Following on from the Contamination & Geotech Expo, AZoCleantech speaks with Barnaby Hayward from P&D Marine Services about his involvement in the clean technology sector and the company’s innovative water management solution - the Jellyfishbot.