Oct 28 2010
Ferro Electronic Materials, a supplier of fabricating materials for use in photovoltaic silicon solar cells, has announced its plans to launch glues that can be used in front and rear contacts of PV solar panels.
The new type of pastes will be launched in the solar energy related expositions, PV Taiwan and DIRECT2010, to be held in Taipei Taiwan and Greater Noida, Delhi, India between 26th and 29th October this year.
The NS 33-512 paste from the Ferro Electronic Materials is meant for use in the front side of the panel and augments the competence of the panel up to 0.6% and allows quicker printing of three bus bar cell designs. The paste is apt to be employed with the predominantly utilized silicon wafers that incorporate 70 ohm/sq emitters. The paste has reduced contact impedance to n-silicon layer passivated silicon nitride; lesser level of series conflicts with higher solids and has the capacity to print 70 micron grid lines with a 0.25 aspect ratio by utilizing the established screening technology.
The AL 53-140 aluminum BSF paste offered by the company slashes the cell costs by lessening the paste lay down time by 25%. The reduced level of organic substance utilized in the paste allows high drying and firing output and preserves low bow with <180 micron wafers. The glue augments the efficiency of the solar cells thus allowing a higher level of open circuit voltage (Voc) than that is available with the conventional paste and provides sturdy BSF for a range of temperatures and increases the bonding to silicon.
The introduced products are meant to increase the solar cell competence and output rates thus allowing the solar energy to develop into a cost-effective and an alternative energy solution. The pastes meet the requirements of RoHS and do not contain lead and phthalate.
Source: http://www.ferro.com/